Finally available is vivo’s brand-new, internally built Imaging Signal Processor (ISP) chip, code-named “V2”.
The V1 and V1+ are two generations of self-developed semiconductors that vivo has released since 2021. The business produced the V2 microprocessor, which uses a revolutionary iterative AI-ISP design. The on-chip memory unit, AI computing unit, and image processing unit are all greatly upgraded by this technology, which also delivers major advances in compatibility and usefulness. MediaTek Dimensity 9200 and V2 now have a new, high-speed communication mechanism thanks to the proposed FIT dual-core connectivity technology. Dual-core interconnection synchronisation between two chips with different architectures and instruction sets can be completed in 1/100 seconds, allowing for the best possible coordination of data and processing power.
According to reports, the V2 has unmatched computing power capacity, computing power density, and data density, greatly improving the capacity and computing speed of the on-chip cache. This is made possible by the DLA or vivo self-developed AI deep learning accelerator module and the large-capacity dedicated on-chip SRAM (high-speed and low-consumption cache unit).
The dedicated Static RAM (SRAM) cache unit may lower high power consumption by over 99.2% and boost the power efficiency ratio to 200% when compared to the DDR external memory design frequently utilised by NPUs.
The structural design of FIT dual-core connectivity and DLA makes it possible to construct the AI-ISP architecture of the V2 chip. To accomplish the ultimate image processing impact and the ultimate energy efficiency ratio, it augments the ISP algorithm and computing power with the platform chip NPU.